Failure Analysis and Evaluation of Material Compatibility of Solder Paste

Abstract:

Solder paste is mainly used for welding of resistance, capacitance, integrated circuit (IC) and other electronic components in surface mounted technology (SMT) industry, and the performance of solder paste has a significant impact on the reliability of electronic components. In this paper, processing defects, failure cases and mechanism of electronic components caused by solder paste are analyzed systematically. Improper application of solder paste during welding can lead to numerous processing defects including poor wetting, tombstoning, bridging, solder joint crack, solder ball spattering, corrosion and so on. Finally, an evaluation method of material compatibility is described in this paper, which provides a reference for ensuring the quality of electronic process material and improving the reliability of SMT products.

• Periodical: Materials Science Forum (Volume 1033)
• Pages: 109-115
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1033.109
• Online since: June 2021
• Authors: Jie Si Luo, Ying Jie Zhang, Zi Lian Liu, Hui Xiao, Xiao Tong Guo*, Huan Xiang Xu
• Keywords: Compatibility, Electronic Components, Failure, Solder Paste, Welding

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