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Investigation of Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment

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Abstract:

The degradation behavior of adhesion between cycloaliphatic epoxy resin and copper under high temperature and high humidity conditions was investigated. The Cu/resin joints were aged at 175°C and at 85°C in 85% R. H. The degradation behavior of the joint interface was analyzed by tensile tests and Fourier infrared transform spectroscopy (FT-IR). As a result, it was confirmed that the adhesion strength was retained after aging at 175°C for 1000 h, while it decreased with an increase in the aging time by aging at 85°C in 85% R. H. Furthermore, the interfacial fracture mode increased with aging at 175°C. In contrast, cohesive fracture was the main fracture mode and hardly changed by aging at 85°C in 85% R. H. The FT-IR analysis results showed that the peak intensity of the carbonyl group increases and that of the methylene group decreases by aging at 175°C. The result indicates that the resin was oxidized. Moreover, the peak intensities of carboxy and hydroxyl groups increased and that of ester groups decreased by aging at 85°C in 85% R. H. The results suggest that ester groups may be hydrolyzed due to aging and thus the adhesion is degraded.

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Periodical:

Materials Science Forum (Volume 1176)

Pages:

59-64

DOI:

https://doi.org/10.4028/p-Fl1IXV

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Online since:

January 2026

Authors:

Anzu Tozaki*, Tatsuya Kobayashi, Ikuo Shohji, Hiroto Takenaka, Hirose Suzuki, Minoru Ueshima

Keywords:

Bond Strength, Cu, Epoxy Resin, High Humidity Storage Test, High Temperature

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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