Effect of Sintering Temperature on Copper Metallization of 3D-Printed Alumina

Abstract:

Alumina (Al₂O₃) is a technical ceramic widely selected for demanding applications due to its excellent material properties, such as high strength, corrosion resistance, and thermal stability. In this study, the effect of the sintering temperature of 3D-printed alumina to its surface characteristics and its subsequent performance as a copper-metallized ceramic substrate was investigated. Green parts of alumina samples were prepared using stereolithography (SLA) 3D printing, debound, then sintered at temperatures ranging from 1660°C to 1740°C. Surface roughness was quantified using Atomic Force Microscopy (AFM), while the copper layer's adhesion was assessed via tape and burnishing tests. Electrical conductivity was measured with a four-point probe. A non-monotonic relationship between sintering temperature and surface roughness was observed. Roughness (Ra​) decreased as temperature increased from 1660°C to 1720°C, attributed to enhanced densification. However, increasing the temperature to 1740°C led to grain coarsening and a slight increase in roughness due to excessive grain growth. Stronger copper adhesion was achieved on smoother surfaces produced at optimized sintering temperatures. Electrical conductivity was also determined with a minimum sheet resistance of 0.089 mΩ/sq achieved.

• Periodical: Materials Science Forum (Volume 1179)
• Pages: 45-51
• DOI: https://doi.org/10.4028/p-AaEYb0
• Online since: March 2026
• Authors: Laureen Ida M. Ballesteros*, Key T. Simfroso, Ray Noel M. Delda, Gina A. Catalan, Denise Daryl A. Florante, Vladimir M. Sarmiento
• Keywords: Additive Manufacturing, Adhesion Strength, Alumina, Ceramics, Electrical Conductivity, Metallization, Sintering

References

[1] Otitoju TA, Okoye PU, Chen G, Li Y, Okoye MO, Li S. Journal of industrial and engineering chemistry 85 (2020): 34-65.

DOI: 10.1016/j.jiec.2020.02.002

[2] Gomez A, Yelamanchi B, Maurel A, Martinez AC, Feldhausen T, Shivakumar J, Rojas E, Lin Y, Cortes P, MacDonald E, Roberson DA IEEE Access 12 (2024): 92295-92305.

DOI: 10.1109/access.2024.3421288

[3] Miek D, Höft M, Lorente JA, Berger A, Brouczek D, Schwentenwein M, Brandao A, Martín-Iglesias P, di Crestvolant VT. IEEE Journal of Microwaves 2.3 (2022): 496-506.

DOI: 10.1109/jmw.2022.3167250

[4] Obeidat AS, Richmond D, Howard-Jennings J, Umar A, Al-Haidari R, Alhendi M, Garakani B, Smilgies DM, Poliks MD. IEEE 74th Electronic Components and Technology Conference (ECTC). IEEE, 2024.

DOI: 10.1109/ectc51529.2024.00114

[5] Halloran, JW. Annual Review of Materials Research 46.1 (2016): 19-40.

[6] Quan H, Zhang T, Xu H, Luo S, Nie J, Zhu X. Bioactive materials 5.1 (2020): 110-115.

[7] Kołczyk K, Zborowski W, Kutyła D, Kwiecińska A, Kowalik R, Żabiński P. Archives of Metallurgy and Materials 63 (2018).

DOI: 10.24425/122438

[8] Miller Z, Fernandes P, Hunter B, Maldonado C, Patterson B, Skoug R. IEEE Aerospace Conference. IEEE, 2024.

[9] Liu W, Shen Y, Li D, Ouyang X, Liu Q, Wang S. Ceramics International 51.4 (2025): 5000-5010.

[10] Moradkhani A, Baharvandi H, Naserifar A.Journal of the Korean Ceramic Society 56.3 (2019): 256-268.

[11] ASTM B571-23 Standard Practice for Qualitative Adhesion Testing of Metallic Coatings.