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Interfacial Thermal Resistance of Al-TiB2 Particle Dispersed Composites with Different Sintering Conditions

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Abstract:

In composite materials, interfacial thermal resistance (ITR) occurs between the matrix and the reinforcement, which is thought to deteriorate effective thermal conductivity (ETC). However, measurement of ITR is difficult, and few measurements have been reported. In this study, the ITR between Al and TiB2 was evaluated by comparing the ETC calculated by image-based thermal conduction simulation using microstructure images with the measured ETC. Al-TiB2 composites were prepared under different sintering conditions and the relationship between sintering conditions and ITR was investigated. Three different volume fractions of TiB2, three different sintering conditions, a total of nine different samples were fabricated with spark plasma sintering (SPS). The Relative density (RD) and ETC of samples with longer holding time is relatively higher than those of samples with shorter holding time, and the ITR at the Al-TiB2 interface decreased in the samples with longer holding time. The samples pressurized after reaching the holding temperature had relatively higher RD, ETC, and ITR at the Al-TiB2 decreased in the samples pressurized after reaching the holding temperature.

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Periodical:

Materials Science Forum (Volume 1195)

Pages:

145-150

DOI:

https://doi.org/10.4028/p-e8YNf8

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Online since:

June 2026

Authors:

Kenjiro Sugio*, Haruki Matsuura, Gen Sasaki

Keywords:

Effective Thermal Conductivity, Image-Based Simulation, Interfacial Thermal Resistance, Metal Matrix Composite, Spark Plasma Sintering, Titanium Di-Boride

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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