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Effect of Zn Addition on the Physical and Mechanical Properties of Sn 0.7Cu1.5Ag Lead-Free Solder Alloy

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Abstract:

The growth of the electronics industry highlights the need for lead-free solder materials that balance environmental safety and performance. This study examines the effect of Zn addition on Sn-0.7Cu-1.5Ag solder alloys containing 7, 8, and 9 wt.% Zn. The alloys were synthesized through melting and solidification, followed by characterization using SEM-EDX, DSC, Vickers hardness, wettability, and density tests. Results indicate that Zn promotes the transformation of Ag3Sn into SnZn3 phases, which dominate with higher Zn levels. The melting point decreased from 223.19 °C to 221.27 °C with a narrower transition range, suggesting improved thermal properties. However, Zn reduced wettability (7.43 mm2 to 5.87 mm2), density (7.33 g/ml to 6.49 g/ml), and hardness (16.1 Hv to 15.4 Hv). Overall, Zn addition lowers the melting point but compromises mechanical strength and spreading ability, indicating the need for optimization to achieve reliable solder performance.

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Periodical:

Materials Science Forum (Volume 1195)

Pages:

61-68

DOI:

https://doi.org/10.4028/p-ltiEU0

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Online since:

June 2026

Authors:

Leo Hermanus Kasi, Andromeda Dwi Laksono*, Hizkia Alpha Dewanto, Muhammad Ramanda Putra, Alvian Toto Wibisono, Fasih Bintang Ilhami

Keywords:

Electronic Waste, Lead, Lead-Free Solder

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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