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Paper Titles
Preface
PECVD of Silicon Dioxide from TEOS/Oxygen Mixtures
p.1
Analysis and Design of Plasma Chemical Reactions Based on Quantum Chemical Methods
p.17
Advanced Simulation of Dry Etching Process Technology
p.25
Anisotropic ECR Plasma Etching with Low-Energy Ions
p.39
High-Rate Sputtering with Electron Cyclotron Resonance and Electric-Mirror Excitation
p.55
Modified ECR Plasma Deposition
p.79
DC Saddle-Field Plasma-Enhanced Vapour Deposition
p.89
Theoretical Characterization of Electron Energy Distribution Function in RF Plasmas
p.107

Preface

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Plasma Properties, Deposition and Etching View Preview

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Periodical:

Materials Science Forum (Volumes 140-142)

Online since:

October 1993

Сopyright:

© 1993 Trans Tech Publications Ltd. All Rights Reserved

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