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HomeMaterials Science ForumMaterials Science Forum Vols. 347-349Internal Stresses in Aluminium Interconnects

Internal Stresses in Aluminium Interconnects

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Residual Stress ECRS 5

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Periodical:

Materials Science Forum (Volumes 347-349)

Pages:

556-561

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.347-349.556

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Online since:

May 2000

Authors:

A. Saerens, Paul van Houtte, A. Witvrouw

Keywords:

Finite Element Model (FEM), Microelectronics, Thermal Stress, Thin Film, X-Ray Diffraction (XRD)

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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