X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths

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Periodical:

Materials Science Forum (Volumes 347-349)

Edited by:

A.J. Böttger, R. Delhez and E.J. Mittemeijer

Pages:

562-567

Citation:

O. Sicardy et al., "X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths", Materials Science Forum, Vols. 347-349, pp. 562-567, 2000

Online since:

May 2000

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$38.00

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