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HomeMaterials Science ForumMaterials Science Forum Vols. 347-349X-Ray Diffraction Determination of Residual...

X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths

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Residual Stress ECRS 5

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Periodical:

Materials Science Forum (Volumes 347-349)

Pages:

562-567

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.347-349.562

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Online since:

May 2000

Authors:

O. Sicardy, I. Touet, L. Arnaud, F. Charlet, T. Berger

Keywords:

Copper (Cu), Elasticity, Microelectronics, Residual Stress, X-Ray Diffraction (XRD)

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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