[1]
S.Y. Yoon, S.J. Park, K.H. Kim, J. Jang, Thin Solid Films. 383 (2001) 34.
Google Scholar
[2]
D. Della Sala, A. Santoni, L. Fornarini, J. Lancok, S. Loreti, I. Menicucci, C. Minarini, Journal of Materials Research 17 (2002) 2966.
DOI: 10.1557/jmr.2002.0430
Google Scholar
[3]
D. Della Sala, S. Loreti, L. Fornarini, I. Menicucci, A. Santoni, P. Delli Veneri, C. Minarini, C. Privato, J. Lancok, Thin Solid Films 403-404 (2002) 302.
DOI: 10.1016/s0040-6090(01)01568-1
Google Scholar
[4]
A. Shih, C.Y. Meng, S.C. Lee, M.Y. Chern, J. Appl. Phys. 88 (2000) 3725.
Google Scholar
[5]
F.A. Quli, J. Singh, Mat. Sci. and Eng. B67 (1999) 139.
Google Scholar
[6]
Y. Kawazu, H. Kudo, S. Onari, T. Arai, Jpn. J. Appl. Phys. 29 (1990) 2698.
Google Scholar
[7]
Landolt-Börnstein, New Series III, Vol. 22b, Edited by O. Madelung, Springer Verlag, Berlin 1987, pp.207-217.
Google Scholar
[8]
Wong M, Jin ZH, Bhat GA, et al. IEEE T. Electron. Dev. 47 (2000) 1061.
Google Scholar