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HomeMaterials Science ForumMaterials Science Forum Vols. 467-470In-Situ EBSD Investigation of Recrystallization in...

In-Situ EBSD Investigation of Recrystallization in ECAE Processed Copper

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Recrystallization and Grain Growth

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Periodical:

Materials Science Forum (Volumes 467-470)

Pages:

1401-1406

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.467-470.1401

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Online since:

October 2004

Authors:

Matthew M. Nowell, David P. Field, Stuart I. Wright, T.M. Lillo

Keywords:

Copper (Cu), Electron Backscatter Diffraction (EBSD), Equal Channel Angular Extrusion (ECAE), In Situ Heating, Orientation Image Microscopy (OIM)

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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