[1]
C.P. Ouyang, J. J. Chang, J.F. Wen, L.C. Tien, J. Hwang and T.W. Pi, J. Appl. Phys. Vol. 91 (2001), p.1204.
Google Scholar
[2]
R. Kurt, W. Pitschke, A. Heinrich, J. Schumann, J. Thomas, K. Wetzig, A. Burkov, Thin Solis Films, Vol. 310 (1997), p.8.
DOI: 10.1016/s0040-6090(97)00326-x
Google Scholar
[3]
C.K. Chunga, J. Hwang, T.H. Jaw, D.S. Wuu, Thin Solid Films, Vol. 373 (2000), p.68.
Google Scholar
[4]
B.Y. Tsaur, C.K. Chen, B.A. Neckay, IEEE Electronic Dev. Lett., Vol. 11 (1990), p.415.
Google Scholar
[5]
R.T. Tung, Phys. Rev. Lett. 52 (1984), p.461.
Google Scholar
[6]
V. Demuth, H.P. Strunk, D. Wörle, C. Kumpf, E. Burkel, and M. Schulz, Appl. Phys. A: Mater. Sci. Process. Vol. 68 (1999), p.451.
Google Scholar
[7]
C.E. Allevato, C.B. Vining, J. Alloys Compounds, Vol. 200 (1993), p.99.
Google Scholar
[8]
P.W. Pellegrini, C.E. Ludington, M.M. Weeks, J. Appl. Phys. Vol. 67(1990) 1417.
Google Scholar
[9]
U. Gösele and K.N. Tu, J. Appl. Phys. Vol. 66 (1989) 2619.
Google Scholar
[10]
B.Y. Tsaur, M.M. Weeks, R. Trubiano, P.W. Pellegrini, T.R. Yew, IEEE Elec. Dev. Lett. Vol. 9 (1988), p.650.
Google Scholar
[11]
E.H. Rhoderick, R.H. Williams, Metal-semiconductor contacts, 2nd edn. Oxford Clarendon, (1988).
Google Scholar
[12]
I. Ohdomari and K.N. Tu, J. Appl. Phys. Vol. 51 (1980), p.3735.
Google Scholar