Inter and Intra Granular Strain Analysis by Microdiffraction Kossel
We have developed a new convenient tool for local stress and strain analysis in the scanning electron microscope. It is based on the Kossel diffraction, physical phenomenon that is known for a long time because of its high accuracy for lattice constant determination in micron regions. The pattern is recorded on a CCD camera allowing a fast and reliable analysis. This technique has been applied to several materials. In-situ tensile tests were performed on a shape memory alloy. During loading, we observe clearly a shift of Kossel lines on the diagram, whose magnitude depends on the (hkl) crystallographic planes. The stress can be deduced from the diffracting plane strain measurement using a single crystal stress analysis.
Sabine Denis, Takao Hanabusa, Bob Baoping He, Eric Mittemeijer, JunMa Nan, Ismail Cevdet Noyan, Berthold Scholtes, Keisuke Tanaka, KeWei Xu
S. Berveiller et al., "Inter and Intra Granular Strain Analysis by Microdiffraction Kossel", Materials Science Forum, Vols. 490-491, pp. 159-164, 2005