Inter and Intra Granular Strain Analysis by Microdiffraction Kossel

Abstract:

We have developed a new convenient tool for local stress and strain analysis in the scanning electron microscope. It is based on the Kossel diffraction, physical phenomenon that is known for a long time because of its high accuracy for lattice constant determination in micron regions. The pattern is recorded on a CCD camera allowing a fast and reliable analysis. This technique has been applied to several materials. In-situ tensile tests were performed on a shape memory alloy. During loading, we observe clearly a shift of Kossel lines on the diagram, whose magnitude depends on the (hkl) crystallographic planes. The stress can be deduced from the diffracting plane strain measurement using a single crystal stress analysis.

• Periodical: Materials Science Forum (Volumes 490-491)
• Pages: 159-164
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.490-491.159
• Online since: July 2005
• Authors: Sophie Berveiller, Pascal Dubos, Karim Inal, André Eberhardt, Etienne Patoor
• Keywords: Kossel Microdiffraction, Local Strain, Stress Analysis

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