Inter and Intra Granular Strain Analysis by Microdiffraction Kossel

Abstract:

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We have developed a new convenient tool for local stress and strain analysis in the scanning electron microscope. It is based on the Kossel diffraction, physical phenomenon that is known for a long time because of its high accuracy for lattice constant determination in micron regions. The pattern is recorded on a CCD camera allowing a fast and reliable analysis. This technique has been applied to several materials. In-situ tensile tests were performed on a shape memory alloy. During loading, we observe clearly a shift of Kossel lines on the diagram, whose magnitude depends on the (hkl) crystallographic planes. The stress can be deduced from the diffracting plane strain measurement using a single crystal stress analysis.

Info:

Periodical:

Materials Science Forum (Volumes 490-491)

Edited by:

Sabine Denis, Takao Hanabusa, Bob Baoping He, Eric Mittemeijer, JunMa Nan, Ismail Cevdet Noyan, Berthold Scholtes, Keisuke Tanaka, KeWei Xu

Pages:

159-164

DOI:

10.4028/www.scientific.net/MSF.490-491.159

Citation:

S. Berveiller et al., "Inter and Intra Granular Strain Analysis by Microdiffraction Kossel", Materials Science Forum, Vols. 490-491, pp. 159-164, 2005

Online since:

July 2005

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Price:

$35.00

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