Residual Stress Analysis in Both As-Deposited and Annealed CrN Coatings

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In this paper, we report on residual stress analysis in physical vapour deposited (PVD) CrN coatings. Two 9 µm thick coatings were grown on tool steel substrates with bias voltages of - 50 V and -300 V, respectively. High-energy (E=80 keV) synchrotron radiation measurements have been performed to investigate residual stresses in both as-deposited and annealed CrN coatings. To understand the origins of non-linear distribution of lattice strain versus sin2ψ for certain (hkl) planes in both coatings, a stress orientation distribution function (SODF) analysis has been carried out, which yields grain-orientation-dependent residual stresses. The results are compared to previous analyses using Reuss and Vook-Witt models on the as-deposited coatings.

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Materials Science Forum (Volumes 490-491)

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643-648

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July 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[1] M. Odén, J. Almer and G. Håkansson: Surf. Coat. Tech., 114 (1) (1999), p.40.

Google Scholar

[2] H. Windischmann: J Vac. Sci. Technol. A 9 (4) (1991), p.2431.

Google Scholar

[3] J. Almer, U. Lienert, R. L. Peng, C. Schlauer and M. Odén : J. Appl. Phys. 94 (1) (2003) p.697.

Google Scholar

[4] M. Leoni, U. Welzel, P. Lampater, E. J. Mittemeijer and J. -D. Kamminga: Philos. Mag. A81, (2001), p.597.

Google Scholar

[5] Y. D. Wang, R. Lin Peng X. L. Wang and R. L. McGreevy: Acta Mater. 50, (2002), p.1717.

Google Scholar

[6] S. D. Shastri, K. Fezzaa, A. Mashayekhi et al.: J. Synchrotron Radiat. 9 (2002), p.317.

Google Scholar

[7] B. D. Cullity, Elements of X-ray Diffraction. Addison-Wesley Publishing Company, Inc. (1978).

Google Scholar

[8] J. Almer, M. Oden, L. Hultman and G. Håkkansson: J Vac. Sci. Technol. A 18 (1) (2000), p.121.

Google Scholar

[9] I.C. Noyan and J.B. Cohen, Residual Stress: Measurement by Diffraction and Interpretation. Springer-Verlag, New York, (1987).

Google Scholar

[10] Y.D. Wang, R.L. Peng, R. McGreevy. In: ICOTOM-12, vol. 1 (1999), p.533.

Google Scholar

[11] F. Elstner, A. Ehrlich, H. Giegenack, H. Kupfer and F. Richter: J Vac. Sci. Technol. A 12 (2) (1994), p.476.

Google Scholar

[12] F. Elstner, C. Gautier, H. Moussaoui, O. Piot and J. Machet: Phys. Stat. sol. (a), 158 (1996), p.505.

Google Scholar