Quantitative Texture Analysis of Electrodeposited Line Patterns

Abstract:

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Free-standing line patterns of Cu and Ni were manufactured by electrochemical deposition into lithographically prepared patterns. Electrodeposition was carried out on top of a highly <111> oriented Au-layer physically vapor deposited on glass. Quantitative texture analysis carried out by means of X-ray diffraction for both the substrate layer and the electrodeposits yielded experimental evidence for epitaxy between Cu and Au. An orientation relation between film and substrate was discussed with respect to various concepts of epitaxy. While the conventional mode of epitaxy fails for the Cu-Au-system, it is shown that the experimentally observed orientation relation can be conceived as a 30º rotation of Cu (111) grown on Au (111) (rotational epitaxy).

Info:

Periodical:

Materials Science Forum (Volumes 495-497)

Edited by:

Paul Van Houtte and Leo Kestens

Pages:

1455-1460

DOI:

10.4028/www.scientific.net/MSF.495-497.1455

Citation:

K. Pantleon and M. A.J. Somers, "Quantitative Texture Analysis of Electrodeposited Line Patterns", Materials Science Forum, Vols. 495-497, pp. 1455-1460, 2005

Online since:

September 2005

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$35.00

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