Quantitative Texture Analysis of Electrodeposited Line Patterns

Karen Pantleon; Marcel A.J. Somers

doi:10.4028/www.scientific.net/MSF.495-497.1455

Paper Titles

Thermomechanical Properties of Nickel Silicide: Dependence on the Microstructure
p.1431

Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo Alloy Tapes for Coated Superconductor Applications
p.1437

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
p.1443

New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines
p.1449

Quantitative Texture Analysis of Electrodeposited Line Patterns
p.1455

The Influence of Palladium Addition on the Texture Transition in Silver
p.1461

Investigation of Local Texture Correlations in Bi-2223 High Temperature Superconductor Tapes
p.1467

Strain Dependence of Magnetic Anisotropy in Low-Carbon Production Steels
p.1475

Anisotropic Increase in Yield Strength by Straining and Baking of Bake-Hardenable Steel
p.1485

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Quantitative Texture Analysis of Electrodeposited Line Patterns

Abstract:

Free-standing line patterns of Cu and Ni were manufactured by electrochemical deposition into lithographically prepared patterns. Electrodeposition was carried out on top of a highly <111> oriented Au-layer physically vapor deposited on glass. Quantitative texture analysis carried out by means of X-ray diffraction for both the substrate layer and the electrodeposits yielded experimental evidence for epitaxy between Cu and Au. An orientation relation between film and substrate was discussed with respect to various concepts of epitaxy. While the conventional mode of epitaxy fails for the Cu-Au-system, it is shown that the experimentally observed orientation relation can be conceived as a 30º rotation of Cu (111) grown on Au (111) (rotational epitaxy).