New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines

Abstract:

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The article takes into account various factors which effect the texture evolution in the Cu lines. We propose here an explanation for the formation of {111}<110> and {111}<112> texture in the Cu lines. The explicit role of principal stresses, shear stresses and dislocations is discussed. The influence of line spacing on strength of the {111}<110> and {111}<112> texture components is also demonstrated in relation to the dislocation density.

Info:

Periodical:

Materials Science Forum (Volumes 495-497)

Edited by:

Paul Van Houtte and Leo Kestens

Pages:

1449-1454

DOI:

10.4028/www.scientific.net/MSF.495-497.1449

Citation:

K. K. Mirpuri and J. A. Szpunar, "New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines ", Materials Science Forum, Vols. 495-497, pp. 1449-1454, 2005

Online since:

September 2005

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Price:

$35.00

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