New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines

Kabir Kumar Mirpuri; Jerzy A. Szpunar

doi:10.4028/www.scientific.net/MSF.495-497.1449

Paper Titles

Texture Studies on Borocarbide Thin Films
p.1425

Thermomechanical Properties of Nickel Silicide: Dependence on the Microstructure
p.1431

Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo Alloy Tapes for Coated Superconductor Applications
p.1437

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
p.1443

New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines
p.1449

Quantitative Texture Analysis of Electrodeposited Line Patterns
p.1455

The Influence of Palladium Addition on the Texture Transition in Silver
p.1461

Investigation of Local Texture Correlations in Bi-2223 High Temperature Superconductor Tapes
p.1467

Strain Dependence of Magnetic Anisotropy in Low-Carbon Production Steels
p.1475

HomeMaterials Science ForumMaterials Science Forum Vols. 495-497New Interpretation of the Influence of Various...

New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines

Abstract:

The article takes into account various factors which effect the texture evolution in the Cu lines. We propose here an explanation for the formation of {111}<110> and {111}<112> texture in the Cu lines. The explicit role of principal stresses, shear stresses and dislocations is discussed. The influence of line spacing on strength of the {111}<110> and {111}<112> texture components is also demonstrated in relation to the dislocation density.