Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo Alloy Tapes for Coated Superconductor Applications

P.P. Bhattacharjee; R.K. Ray; A. Upadhyaya

doi:10.4028/www.scientific.net/MSF.495-497.1437

Paper Titles

The Correlation of Texture and Microstructure to the Corrosion Resistance of Tin Coatings
p.1413

The Role of Special Boundaries during Solidification and Microstructure Evolution in Lead Free Solder Joints
p.1419

Texture Studies on Borocarbide Thin Films
p.1425

Thermomechanical Properties of Nickel Silicide: Dependence on the Microstructure
p.1431

Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo Alloy Tapes for Coated Superconductor Applications
p.1437

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
p.1443

New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines
p.1449

Quantitative Texture Analysis of Electrodeposited Line Patterns
p.1455

The Influence of Palladium Addition on the Texture Transition in Silver
p.1461

HomeMaterials Science ForumMaterials Science Forum Vols. 495-497Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo...

Cube Texture Formation in P/M Ni, Ni-W and Ni-Mo Alloy Tapes for Coated Superconductor Applications

Abstract:

Pure Ni, Ni-5at.%Mo and Ni-5at.%W prepared through P/M route have been severely cold deformed (~95%) and given different heat treatments to develop sharp cube component ({001}<100>) for coated superconductor applications. It was found that amongst the three materials studied, Ni-5at%W develops the most sharp cube texture. This is in contrary to the observation in similar materials produced by the melting and casting route.