Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains

Alexei Vinogradov; T. Suzuki; Satoshi Hashimoto; Kazuo Kitagawa; A.A. Kuznetsov; Sergey V. Dobatkin

doi:10.4028/www.scientific.net/MSF.503-504.971

Paper Titles

Microstructures and Mechanical Properties of Mg Alloy after Severe Torsion Straining Process
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Grain Refinement of Commercial Al-Mg Alloy Using Severe Torsion Straining Process
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Effect of Severe Plastic Deformation on the Structure and Properties of the Age-Hardenable Mg-Sm Alloys
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Hardening Mechanisms of Metals and Alloys Produced by SPD
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Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains
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Grain Refinement by High Temperature Plane-Strain Compression of Fe-2%Si Steel
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The Effect of Equal-Channel Angular Pressing on Structure-Phase Changes and Superplastic Properties of Al-Mg-Li Alloy
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Dislocation-Crystal Plasticity Simulation Based on Self-Organization for Repartition of Dislocation Cell Structures and Subgrain
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HomeMaterials Science ForumMaterials Science Forum Vols. 503-504Structure and Mechanical Properties of...

Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains

Abstract:

The present work is aimed at linking the microstuctutral features obtained after severe plastic deformation via ECAP to the tensile behavior and thermal stability of pure (99.98%) copper processed by routes A and Bc to different number of passes. The main conclusion one can draw unambiguously from the currently available results is that the strain path exerts relatively little effect on the resultant tensile properties when the number of pressing is sufficiently large, although there have been some marked differences in crystallographic textures and distribution of grain-boundaries. The effect of the number of pressings on the tensile ductility is considerable.

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Periodical:

Materials Science Forum (Volumes 503-504)

Pages:

971-976

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.503-504.971

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Online since:

January 2006

Authors:

Alexei Vinogradov, T. Suzuki, Satoshi Hashimoto, Kazuo Kitagawa, A.A. Kuznetsov, Sergey V. Dobatkin

Keywords:

Copper (Cu), Electron Backscatter Diffraction (EBSD), Equal-Channel Angular Pressing (ECAP), Mechanical Property, Microstructure, Thermal Stability

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