Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope

Abstract:

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A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses on the micron scale, using a one cubic micrometer spot. The experimental Kossel line patterns are obtained by way of a CCD camera and are then fully indexed using a home-made simulation program. The so-determined orientation is compared with Electron Back-Scattered Diffraction (EBSD) results, and in-situ tests are performed inside the SEM using a tensile/compressive machine. The aim is to verify a 50MPa stress sensitivity for this technique and to take advantage from this microscope environment to associate microstructure observations (slip lines, particle decohesion, crack initiation) with determined stress analyses.

Info:

Periodical:

Materials Science Forum (Volumes 524-525)

Edited by:

W. Reimers and S. Quander

Pages:

109-114

DOI:

10.4028/www.scientific.net/MSF.524-525.109

Citation:

R. Pesci, K. Inal, S. Berveiller, E. Patoor, J. S. Lecomte, A. Eberhardt, "Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope ", Materials Science Forum, Vols. 524-525, pp. 109-114, 2006

Online since:

September 2006

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Price:

$35.00

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