Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope

Raphaël Pesci; Karim Inal; Sophie Berveiller; Etienne Patoor; Jean Sébastien Lecomte; André Eberhardt

doi:10.4028/www.scientific.net/MSF.524-525.109

Paper Titles

A Novel Closed-Form Calculation of the Stress Intensity Factor for a Crack in a Residual Stress Field
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Residual Stresses in 3D Sheet Metal Guillotining Using a Coupled Finite Elastoplastic Damage Model
p.89

Residual Stress State at Different Scales in Deep Drawn Cup of Unstable Austenitic Steel
p.95

White Beam Microdiffraction Experiments for the Determination of the Local Plastic Behaviour of Polycrystals
p.103

Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope
p.109

Determinability of Complete Residual Strain Tensor from Multiple CBED Patterns
p.115

FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation
p.121

Residual Stress State and Fatigue Behaviour of Laser Shock Peened Titanium Alloys
p.129

Dynamic Analysis of Residual Stress Introduced by Laser Peening
p.135

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Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope

Abstract:

A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses on the micron scale, using a one cubic micrometer spot. The experimental Kossel line patterns are obtained by way of a CCD camera and are then fully indexed using a home-made simulation program. The so-determined orientation is compared with Electron Back-Scattered Diffraction (EBSD) results, and in-situ tests are performed inside the SEM using a tensile/compressive machine. The aim is to verify a 50MPa stress sensitivity for this technique and to take advantage from this microscope environment to associate microstructure observations (slip lines, particle decohesion, crack initiation) with determined stress analyses.