Fabrication of Ultra-Fine Abrasive Polishing Pads by Gel Technique

Juan Liu; Yi Qing Yu; Xi Peng Xu

doi:10.4028/www.scientific.net/MSF.532-533.468

Paper Titles

Study of the Removing Depth of the Polishing Surface Based on a Novel Spinning-Inflated-Ballonet Polishing Tool
p.452

Application of an Intelligent Force Controller for Robotic Deburring Process
p.456

Study on Fixed Abrasive Lapping Technology for Ceramic Balls
p.460

Investigation of Technology and Analysis of Residual Stress in Large Area Diamond Films
p.464

Fabrication of Ultra-Fine Abrasive Polishing Pads by Gel Technique
p.468

A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer
p.472

Finite Element Analysis of the Electromagnetic Field of Untouched Permanent Induction Magnetic Coupling
p.476

Effects of CH₄ Concentration on CVD Diamond Coatings Deposited on Cemented Carbide Cutting Cools
p.480

On Study of Cutting Forces Generated by Minor Cutting Edges
p.484

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Fabrication of Ultra-Fine Abrasive Polishing Pads by Gel Technique

Abstract:

In this paper, an experimental study was carried out to fabricate a new kind of ultra-fine abrasive polishing pad by means of gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. Optical microscope and ZYGO 3D surface analyzer were applied to observe the surface morphologies of the silicon wafer. Meanwhile, surface morphology of ultra-fine abrasive polishing pad was observed by ESEM. No obvious gathering of ultra-fine grains were found on the ultra-fine abrasive pad. The surface roughness (Ra) of the silicon wafer was reduced to 0.3nm after being polished by the abrasives with average grain size of 10μm. Mirror surface can be realized after being polished with the polishing pad.