Fabrication of Ultra-Fine Abrasive Polishing Pads by Gel Technique

Abstract:

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In this paper, an experimental study was carried out to fabricate a new kind of ultra-fine abrasive polishing pad by means of gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. Optical microscope and ZYGO 3D surface analyzer were applied to observe the surface morphologies of the silicon wafer. Meanwhile, surface morphology of ultra-fine abrasive polishing pad was observed by ESEM. No obvious gathering of ultra-fine grains were found on the ultra-fine abrasive pad. The surface roughness (Ra) of the silicon wafer was reduced to 0.3nm after being polished by the abrasives with average grain size of 10μm. Mirror surface can be realized after being polished with the polishing pad.

Info:

Periodical:

Materials Science Forum (Volumes 532-533)

Edited by:

Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu

Pages:

468-471

DOI:

10.4028/www.scientific.net/MSF.532-533.468

Citation:

J. Liu et al., "Fabrication of Ultra-Fine Abrasive Polishing Pads by Gel Technique", Materials Science Forum, Vols. 532-533, pp. 468-471, 2006

Online since:

December 2006

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Price:

$35.00

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