Effect of Film Thickness and Annealing Temperature in Stress-Induced Damage in Metal Films

Young Chang Joo; Soo Jung Hwang

doi:10.4028/www.scientific.net/MSF.539-543.3520

Paper Titles

Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization
p.3497

Behavior of Oxide Film in Transient-Liquid-Phase Bonding of Tin with Filler of Bismuth Film
p.3503

Microstructure and Gas Sensing Property of Porous SnO₂ Sputtered Films
p.3508

Luminance Characterization of La₃Ga₅SiO₁₄ Thin Films by Sputtering Deposition
p.3514

Effect of Film Thickness and Annealing Temperature in Stress-Induced Damage in Metal Films
p.3520

Self-Assembly of Nano-Sized Arrays on Highly Oriented Thin Films of Poly(tetrafluoroethylene)
p.3525

Atomic Assembly of Thin Film Materials
p.3528

Measuremet of Mechanical Properties of Thin Films and Nanostructured Materials at High Spatial Resolution
p.3534

The Role of Segregation in InGaAs Heteroepitaxy
p.3540

HomeMaterials Science ForumMaterials Science Forum Vols. 539-543Effect of Film Thickness and Annealing Temperature...

Effect of Film Thickness and Annealing Temperature in Stress-Induced Damage in Metal Films

Abstract:

Hillocks were observed in various thick Al films after annealing for a long time and their density and diameter were measured using an image analysis program. The hillock density decreased while the diameter increased with increasing film thickness. The total hillock volume per unit area of the film is linearly proportional to the film thickness and annealing temperature. Based on the results of our investigation, the effect of the film thickness, grain size and annealing temperature on hillock formation is discussed, and an equation that can be used to predict the hillock density and average hillock diameter is suggested.