Structural, Electrical and Magnetic Properties of Ni33Fe67 and Ni21Fe79 Films Deposited on SiO2/Si(100) at 633 K by DC Magnetron Co-Sputtering

Abstract:

Article Preview

180nm-thick Ni33Fe67 and Ni21Fe79 films were deposited on SiO2/Si(100) substrates at 633 K by DC magnetron co-sputtering. Structural, electrical and magnetic properties of the films were investigated using X-ray diffraction, field emission scanning electron microscopy, a four-point probe technique and an alternating gradient magnetometer. The Ni21Fe79 film has a single bcc structure whereas the Ni33Fe67 film is a fcc-bcc mixed phase. The films grow with granular grains. The grain shape of the Ni21Fe79 film is triangular and rectangular. The Ni33Fe67 film consists of irregular shaped grains and a few large triangular grains. The grain size of the Ni21Fe79 film is larger than that of the Ni33Fe67 film. The resistivities of the Ni21Fe79 and Ni33Fe67 films are 1.82×10-63m and 1.09×10-63m. The saturation magnetization of the Ni21Fe79 and Ni33Fe67 films are 1.09×106 A/m and 1.02×106 A/m. The coercivity of the Ni21Fe79 and Ni33Fe67 films are 2.06×104 A/m and 8.84×103 A/m , respectively.

Info:

Periodical:

Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

1141-1144

Citation:

X. B. Chen et al., "Structural, Electrical and Magnetic Properties of Ni33Fe67 and Ni21Fe79 Films Deposited on SiO2/Si(100) at 633 K by DC Magnetron Co-Sputtering", Materials Science Forum, Vols. 561-565, pp. 1141-1144, 2007

Online since:

October 2007

Export:

Price:

$38.00

[1] B. K. Kuanr, R. E. Camley, Z. Celinski. J. Magn. Magn. Mater. 286(2005)276.

[2] X. B. Chen, H. Qiu, H. Qian, P. Wu, F. P. Wang, L. Q. Pan, Y. Tain. Vacuum. 75(2004)217.

[3] M. Tanaka, E. Saitoh, H. Miyajima, T. Yamaoka. J. Magn. Magn. Mater. 282(2004)22.

[4] B. Dai, J. W. Cai, W. Y. Lai. J. Magn. Magn. Mater. 257(2003)190.

[5] B. Warot, J. Imrie, A. K. Petford-Long, J. H. Nickel, T. C. Anthony. J. Magn. Magn. Mater. 272-276(2004)el495.

[6] C. Garrett, P. Hodlang, J. G. Wilhelmus, D. Ragan, A. Dubey, S. Rios, A. J. Appl. Phys. 93(2003)8624.

[7] P. Wu, F. P. Wang, H. Qiu, L. Q. Pan, Y. Tain. Rare Metals. 22(2003)202.

[8] X. B. Chen, H. Qiu, P. Wu, F. P. Wang, L. Q. Pan, Y. Tain. Physic B. 362(2005)255.

[9] A. Kinbara, H. Fujiwara. Thin films. Tokyo. Syokabo. (1991) p.250 [in Japanese].

[10] K. Schroder. CRC Handbook of Electrical Resistivities of Binary Metallic Alloys. CRC press. Florida. (1983) p.246.

[11] X. B. Chen, H. Qiu, P. Wu, L. Q. Pan, F. P. Wang, Nanoscience, 11(1)(2006).