Structural, Electrical and Magnetic Properties of Ni33Fe67 and Ni21Fe79 Films Deposited on SiO2/Si(100) at 633 K by DC Magnetron Co-Sputtering

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180nm-thick Ni33Fe67 and Ni21Fe79 films were deposited on SiO2/Si(100) substrates at 633 K by DC magnetron co-sputtering. Structural, electrical and magnetic properties of the films were investigated using X-ray diffraction, field emission scanning electron microscopy, a four-point probe technique and an alternating gradient magnetometer. The Ni21Fe79 film has a single bcc structure whereas the Ni33Fe67 film is a fcc-bcc mixed phase. The films grow with granular grains. The grain shape of the Ni21Fe79 film is triangular and rectangular. The Ni33Fe67 film consists of irregular shaped grains and a few large triangular grains. The grain size of the Ni21Fe79 film is larger than that of the Ni33Fe67 film. The resistivities of the Ni21Fe79 and Ni33Fe67 films are 1.82×10-63m and 1.09×10-63m. The saturation magnetization of the Ni21Fe79 and Ni33Fe67 films are 1.09×106 A/m and 1.02×106 A/m. The coercivity of the Ni21Fe79 and Ni33Fe67 films are 2.06×104 A/m and 8.84×103 A/m , respectively.

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Periodical:

Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

1141-1144

DOI:

10.4028/www.scientific.net/MSF.561-565.1141

Citation:

X. B. Chen et al., "Structural, Electrical and Magnetic Properties of Ni33Fe67 and Ni21Fe79 Films Deposited on SiO2/Si(100) at 633 K by DC Magnetron Co-Sputtering", Materials Science Forum, Vols. 561-565, pp. 1141-1144, 2007

Online since:

October 2007

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$35.00

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