Determination of the Residual Stress Field around Scratches Using Synchrotron X-Rays and Nanoindentation

M.K. Khan; Michael E. Fitzpatrick; L.E. Edwards; S.V. Hainsworth

doi:10.4028/www.scientific.net/MSF.652.25

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HomeMaterials Science ForumMaterials Science Forum Vol. 652Determination of the Residual Stress Field around...

Determination of the Residual Stress Field around Scratches Using Synchrotron X-Rays and Nanoindentation

Abstract:

The residual strain field around the scratches of 125µm depth and 5µm root radius have been measured from the Synchrotron X-ray diffraction. Scratches were produced using different tools in fine-grained aluminium alloy AA 5091. Residual stresses up to +1700 micro-strains were measured at the scratch tip for one tool but remained up to only +1000 micro-strains for the other tool scratch. The load-displacement curves obtained from nanoindentation were used to determine the residual stresses around the scratches. It was found that the load-displacement curves are sensitive to any local residual stress field present and behave according to the type of residual stresses. This combination of nanoindentation and synchrotron X-rays has been proved highly effective for the study of small-scale residual stresses around the features such as scratches.

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Periodical:

Materials Science Forum (Volume 652)

Pages:

25-30

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.652.25

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Online since:

May 2010

Authors:

M.K. Khan, Michael E. Fitzpatrick, L.E. Edwards, S.V. Hainsworth

Keywords:

Nanoindentation, Residual Stress, Root Radius, Scratches, Synchrotron X-Ray

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