Simultaneous Enhancement of Electrical Conductivities and Mechanical Properties in Cu-Ti Alloy by Hydrogenation Process

Abstract:

Article Preview

Effects of hydrogenation process of the microstructure, electrical conductivity and mechanical properties for the Cu-(1~3) mass%Ti alloys were investigated. During hydrogenation process at 350°C, 7.5 MPa for 48 h, the disproportionation reaction occurred with forming of Ti hydrides in the alloy. It is found that remarkable simultaneous improvements of mechanical strength of 1094 MPa and electrical properties of 21%IACS are obtained in the hydrogenated Cu-3mass%Ti alloy.

Info:

Periodical:

Materials Science Forum (Volumes 654-656)

Main Theme:

Edited by:

Jian-Feng Nie and Allan Morton

Pages:

1319-1322

Citation:

A. Kamegawa et al., "Simultaneous Enhancement of Electrical Conductivities and Mechanical Properties in Cu-Ti Alloy by Hydrogenation Process", Materials Science Forum, Vols. 654-656, pp. 1319-1322, 2010

Online since:

June 2010

Export:

[1] J.L. Murray: Binary Alloys Phase Diagrams Second Edition (1990), 1494-1496.

[2] D.E. Laughlin, J.W. Cahn: Acta Metall., 23 (1975), 329-339.

[3] A. Datta and W.A. Soffa: Acta Metall.: 24 (1976) 987.

[4] S. Nagarjuna, M. Srinvivas, K. Balasubraman and D.S. Sarma: Mater. Sci. Eng. A 259 (1999) 34-42.

[5] W.A. Soffa, D.E. Laughlin: Prog. Mater. Sci., 49 (2004) 347-366.

[6] H. Takamura, T. Amemiya, A. Kamegawa, M. Okada: Mater. Trans. 41 (2000) 1142-1145.

[7] A. Kamegawa, T. Miyashita, H. Ogasawara, H. Takamura and M. Okada: Materials Science Forum, 419-422 (2003) 931-936.

DOI: https://doi.org/10.4028/www.scientific.net/msf.419-422.931

[8] T. Miyazawa, Y. Kobayashi, A. Kamegawa, H. Takamura and M. Okada: Mater. Trans. 45 (2004) 384-387.

[9] A. Kamegawa, T. Funayama, J. Takahashi, H. Takamura and M. Okada: Mater. Trans. 46 (2005) 2449-2453.

[10] A. Kamegawa and M. Okada: TMS Proceedings of 137th Annual Meeting, (2008), 251-256.

[11] T. Iwaki, T. Kuriiwa, A. Kamegawa, H. Takamura1 and M. Okada: Mater. Trans. 50 (2009) 499-505.

[12] S. Semboshi and T . Konno: J. Mater. Res. 23 (2008) 473-477.

[13] S. Semboshi, T. Nishida, H. Numakura and T. Konno: Journal of the JRICu 47 (2008) 165-170. (In Japanese).

[14] S. Suzuki, K. Hirabayashi, H. Shibata, K. Mimura, M. Isshiki, and Y. Waseda: Scripta Mater. 48 (2003) 431-435.

[15] J. Dutkiewicz: Bull. Acad. Polon. Sci. 22 (1974) 323-328.