Ultrafine-grained (UFG) commercially pure (CP) Ti with a grain size of about 200 nm was produced by ECAP up to 8 passes using route BC at room temperature. For ECAP processing a proper die set was designed and constructed with an internal channel angle Φ of 120° and an outer arc of curvature Ψ of 20°. Strain rate sensitivity of UFG CP-Ti and CG CP-Ti were investigated by compression tests in the temperature range of 298~673K and strain rate range of 10-4~100s-1 using Gleeble simulator machine. Evolution of the microstructure during compression testing was observed using optical microscopy (OM) and transmission electron microscopy (TEM). Strain rate sensitivity value m of the UFG CP-Ti has been measured and is found to increase with increasing temperature and decreasing strain rate, and is enhanced compared to that of CG CP-Ti. Result of the deformation activation energy determination of UFG CP-Ti indicates that the deformation mechanism in UFG CP-Ti is correlated to the grain boundaries.