Seebeck Coefficient of Heavily Doped Polycrystalline 3C-SiC Deposited by LPCVD

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Abstract:

The Seebeck coefficient of heavily-nitrogen-doped n-type polycrystalline 3C-SiC (n-SiC) and platinum (Pt) thin films has been measured from room temperature up to 300 °C by using a microfabricated test structure. At room temperature, the absolute Seebeck coefficient of the n-SiC is -10 μV/°C. With ambient temperature increase, the absolute Seebeck coefficient of the n-SiC is found to gradually increase, reaching -20 μV/°C at 300 °C.

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Materials Science Forum (Volumes 717-720)

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541-544

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May 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] M. Mehregany, C. A. Zorman, N. Rajan and C. H. Wu, Silicon carbide MEMS for harsh environments, Proceedings of the IEEE 86 (1998) 1594-1609.

DOI: 10.1109/5.704265

Google Scholar

[2] N. G. Wright and A. B. Horsfall, SiC sensors: A review, J. Phys. D: Appl. Phys. 40 (2007) 6345.

Google Scholar

[3] C. S. Roper, V. Radmilovic, R. T. Howe and R. Maboudian, Electrical and mechanical characterization of doped and annealed polycrystalline 3C-SiC thin films, J. Electrochem. Soc. 156 (2009) D5-D10.

DOI: 10.1149/1.3000002

Google Scholar

[4] F. Liu, C. Carraro, A. A. Pisano and R. Maboudian, Growth and characterization of nitrogen-doped polycrystalline 3C-SiC thin films for harsh environment MEMS applications, J. Micromech. Microeng. 20 (2010) 035011.

DOI: 10.1088/0960-1317/20/3/035011

Google Scholar

[5] J. P. Moore and R. S. Graves, Absolute Seebeck coefficient of platinum from 80 to 340 K and the thermal and electrical conductivities of lead from 80 to 400 K, J. Appl. Phys. 44 (1973) 1174-1178.

DOI: 10.1063/1.1662324

Google Scholar

[6] D. D. Pollock, Thermoelectric phenomena, in: Physical Properties of Materials for Engineers, CRC Press, Inc., Florida, 2002, pp.229-264.

Google Scholar

[7] X. Fu, J. L. Dunning, C. A. Zorman and M. Mehregany, Polycrystalline 3C-SiC thin films deposited by dual precursor LPCVD for MEMS applications, Sens. Actuators, A. 119 (2005) 169-176.

DOI: 10.1016/j.sna.2004.09.009

Google Scholar

[8] S. Jin, X. Fu and M. Mehregany, Ohmic contacts on m-type polycrystalline silicon carbide with Ti/TiSi2/Pt, in TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 15th International Conference on 2009, Denvor, CO (2009) 1083-1086.

DOI: 10.1109/sensor.2009.5285947

Google Scholar