Multiscale Copper-µDiamond Nanostructured Composites

Abstract:

Nanostructured copper-diamond composites can be tailored for thermal management applications at high temperature. A novel approach based on multiscale diamond dispersions is proposed for the production of this type of materials: a Cu-nDiamond composite produced by high-energy milling is used as a nanostructured matrix for further dispersion of micrometer sized diamond. The former offers strength and microstructural thermal stability while the latter provides high thermal conductivity. A series of Cu-nDiamond mixtures have been milled to define the minimum nanodiamond fraction suitable for matrix refinement and thermal stabilization. A refined matrix with homogenously dispersed nanoparticles could be obtained with 4 at.% nanodiamond for posterior mixture with mDiamond and subsequent consolidation. In order to define optimal processing parameters, consolidation by hot extrusion has been carried out for a Cu-nDiamond composite and, in parallel, for a mixture of pure copper and mDiamond. The materials produced were characterized by X-ray diffraction, scanning and transmission electron microscopy and microhardness measurements.

• Periodical: Materials Science Forum (Volumes 730-732)
• Pages: 925-930
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.730-732.925
• Online since: November 2012
• Authors: Daniela Nunes, Vanessa Livramento, Horácio Fernandes, Carlos Silva, Nobumitsu Shohoji, José B. Correia, Patricia A. Carvalho
• Keywords: Composite, Extrusion, High Energy Milling, Microdiamond, Nanodiamond

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