Microstructure Evolution and Creep Behavior in ECAP Processed Metallic Materials

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Abstract:

The creep behavior of high purity aluminum and copper, Al-0.2wt.%Sc and Cu-0.2wt.%Zr alloys was examined after processing by equal-channel angular pressing (ECAP) with an emphasis on the link between microstructure and creep. The microstructure was revealed by electron backscatter diffraction (EBSD) and analyzed by stereological methods. Representative microstructural parameters were obtained using orientation imaging microscopy and EBSD on the relationship between creep behavior and microstructure.

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Materials Science Forum (Volumes 783-786)

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2689-2694

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May 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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