Surface Roughness in Alumina Thin Film Deposited on Silica Using Oblique Incidence

Abstract:

The main characteristics of a surface are physical and chemical structure, surface tension and surface roughness. Surface roughness is one of the critical factors, which could cause instability in quality performance. In this paper, surface roughness of alumina thin films deposited on a silicon substrate by using electron beam evaporation with oblique angle deposition were studied. It has been found that the surface roughness of the alumina thin films was dependent on the substrate temperature, the deposition rate, the film thickness and the inclined angle. The experimental results showed that increasing the substrate temperature reduced the surface roughness at a low inclined angle and enhanced the surface roughness at a high inclined angle, and the surface roughness increased with increasing deposition rate and film thickness. By choosing the appropriate film preparation parameters, the film surface roughness was effectively controlled.

• Periodical: Materials Science Forum (Volume 787)
• Pages: 373-377
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.787.373
• Online since: April 2014
• Authors: Li Jun He, Chuan Li, Xing Zhao Liu*
• Keywords: e-Beam Evaporation, Oblique Angle Deposition Method, Surface Roughness (SR)

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