Examination of Thermodynamic Realignments of Metals and Metal-Alloys, by DMTA Technique

Béres Gábor; Zsolt Dugár; Dávid Kis; Pál Hansághy

doi:10.4028/www.scientific.net/MSF.812.291

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Examination of Thermodynamic Realignments of Metals and Metal-Alloys, by DMTA Technique
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HomeMaterials Science ForumMaterials Science Forum Vol. 812Examination of Thermodynamic Realignments of...

Examination of Thermodynamic Realignments of Metals and Metal-Alloys, by DMTA Technique

Abstract:

The researcher work pushes the borders of the application of a high efficiency equipment, in the matter of metals. With this equipment, which already testified in the compound industry, a flasher query of some metal-related technological parameters could be easily available. Towards the searching, we shaped different compound copper-alloy samples, in different states, and accordingly we monitored the realignments. Following the shaping, the DMTA detected such microscopic transformations (as we expected), according to heating rate, whereby we could determine the specialities of the transformations. In order to monitor the effect of the work hardening, we applied two different shaping grade: 50% and 75%. The heat treatment already took place in the DMTA, using 3 K/min heating rate. The specimens were loaded by inflection in the 2-point bending support with constant frequency and amplitude.Our current object was the monitoring of the recrystallization, and the investigation of the influential factors of this process, but other transitions were also regarded. Those measurements’ results, that the DMTA presented, had been compared with DSC and hardness analysis, whereby we try to conclude to the utility of DMTA, in matter of metal alloys.

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Periodical:

Materials Science Forum (Volume 812)

Pages:

291-296

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.812.291

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Online since:

February 2015

Authors:

Béres Gábor*, Zsolt Dugár, Dávid Kis, Pál Hansághy

Keywords:

Brasses, DMTA, DSC, Hardness Analyze, Recrystallization, Tin-Bronzes, Viscoelastic

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