Applying Chemometrics for Analysis of SiC Raman Imaging Data

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Abstract:

New ultrafast Raman imaging methods allow high definition data to be collected from a whole wafer scale down to individual defects in 2D and 3D, on a time scale suitable for routine quality control. On the other hand, just one hour of data collection can result in datasets containing 105~106 spectra, and attempts to manually analyze such big data with traditional univariate methods can take days, without guarantee that all important information is revealed. Such problem can be easily overcome with fast and automated multivariate analysis methods. Here we introduce the techniques and demonstrate applications to SiC.

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Materials Science Forum (Volumes 821-823)

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241-244

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June 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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