Materials Science Forum Vols. 821-823

Abstract: The effect of the porous graphite plate above the source material on properties of silicon carbide (SiC) crystals grown by Physical Vapor Transport method has been investigated. The porous graphite plate was inserted on source powder to produce a more C-rich for the polytype stability of 4H-SiC crystal and a uniform radial temperature gradient. The dendrite structure obtained from SiC source powder in the crucible with porous graphite plate was more densely formed than that in the conventional crucible. The crystal quality of 4H-SiC single crystals grown in porous graphite inserted crucible was revealed to be better than that of crystal grown SiC crystals in the conventional crucible.

Abstract: p-type SiC crystals doped with aluminum and nitrogen were grown by the sublimation method. We found that Al and N co-doping is effective for stabilized growth of p-type 4H-SiC polytype. We studied the relationship of polytype of grown crystals and the condition of Al and N feeding during the crystal growth. p-type 4H-SiC with p~1 x 10¹⁸ cm^-3 are stably-obtained with this method.

Abstract: High-quality 100 mm 4H-SiC boules were grown using the physical vapor transport (PVT) method with optimized growth parameters. Micro-Raman spectroscopy measurement shows that the 4H-SiC polytype of the entire wafer is uniform. The micropipe density is measured to be less than 1cm^-2. The 1c threading screw dislocation (TSD) density can be suppressed to the magnitude of 10² cm^-2. After chemical mechanical polishing (CMP), it is found that the warp of the substrate is less than 10 μm, and the surface roughness (Ra) is as low as 0.063 nm.

Abstract: The commercial availability of high quality 150 mm 4H SiC wafers has aided in the growth of SiC power device fabrication. The progress of 150 mm 4H SiC wafer development at Dow Corning is reviewed. Defect densities compare well to those typical for 100 mm wafers, with even lower threading screw dislocation densities observed in 150 mm wafers. Resistivity data shows a comparable range from 0.012 – 0.025 ohm.cm, and excellent shape control is highlighted for wafer thicknesses of 350 μm and 500 μm.

Abstract: We address the problem of nitrogen incorporation during bulk crystal growth of 4H-SiC and 6H-SiC by seeded sublimation method. The partial pressure of nitrogen and temperature dependence were considered in bulk SiC crystals. Free carrier concentration and incorporated nitrogen were determined using Raman spectroscopy and Secondary Ion Mass Spectrometry, respectively. The incorporated nitrogen at the (000-1) C-face of 4H-SiC and 6H-SiC is found to be independent of the polytype of the crystal. Higher desorption rate at Si-face compared to C-face is found, using a Langmuir equation, which is attributed to the difference in bond density between the two polar faces. The increased nitrogen desorption when growth temperature increases is believed to be the most contributing factor, based on the temperature dependent trends.

Abstract: The surface morphology on the (000-1)C facet of 4H-SiC boules grown by the physical vapor transport method was examined in various scales (from millimeter to nanometer) using different types of microscopies such as differential interference contrast (DIC) optical microscopy and atomic force microscopy (AFM). The DIC optical microscope observation revealed that there exist three distinct morphological regions at the growth front of the 4H-SiC boules; they are facetted, non-facetted, and the intermediate region between them. The local inclination of the facet surface from the (000-1) basal plane increases toward the facet edge and then decreases over the intermediate region. AFM observations revealed characteristic step structures in these two regions and also that they are significantly influenced by nitrogen-doping. Based on the results, the formation mechanism of the facet morphology on 4H-SiC boules is discussed.

Abstract: Bulk 4H-SiC crystals were grown on 4° off-axis seeds by the physical vapor transport technique. Two completely different surface morphologies of as-grown crystals were observed by laser scanning confocal microscopy. The formation mechanisms of the different surface morphologies are proposed and discussed. We found that the facet formation and migration on the 4° off-axis seeds largely depended on the profile evolution of the temperature field in the growth cell over a long-term growth run. At the interface between the two growth regimes, some grown-in defects, including micropipes, dislocations and polytype inclusions, were frequently observed by polarizing optical microscopy and chemical etching. The stress induced by step coalescence could be responsible for the formation of these grown-in defects.

Abstract: We found that the polarity of the 4H-SiC is reversed from Si-face to C-face by high Al doping during the physical vapor transport (PVT) growth. KOH etching and deep ultraviolet (DUV) Raman spectroscopy were used to confirm the polarity of the grown crystals. The results show the polarity inversion is occurred in the samples grown on Si-face SiC with using Al doped SiC source material.

Abstract: We have investigated the growth of 3C-SiC using sublimation growth in the temperature range from 1800°C to 1950°C. The supersaturation was determined using numerical modeling of the temperature field and gas phase composition by applying quasi-equilibrium thermodynamic conditions. Analysis of the 3C-SiC yield was carried out by optical microscopy, optical absorption, Raman spectroscopy and x-ray analysis. Quantitative data on supersaturation are compared with most stable 3C-SiC nucleation and growth condition. Finally the application to large area growth in a physical vapor transport growth reactor is briefly addressed.

Abstract: Iron (Fe) impurity concentrations in a SiC bulk crystal and source powders used for the bulk crystal growth are analyzed by means of secondary ion mass spectrometry and the validity of the obtained data are discussed. The secondary ion signal of ⁵⁶Fe is found to be affected significantly by the mass interference of ²⁸Si₂, and therefore measurements of ⁵⁴Fe instead of ⁵⁶Fe offer a better detection limit for the analysis. A high concentration of Fe is found at proximity of the SiC bulk crystal surface. Possible sources of the Fe contamination are discussed based on the depth profile data of Fe in both the bulk crystal and the source powders.