A New Lead-Free Solder Joint Utilizing Superplastic Al-Zn Eutectoid Alloy for Next Generation SiC Power Semiconductor Devices

Abstract:

A new high-temperature lead-free solder joint which withstands up to 300°C utilizing superplasticity in the Al-Zn eutectoid alloy has been developed to realize SiC power semiconductor devices. The new solid state joining process consists of interfacial cleaning of joints utilizing superplasticity of the Al-Zn-eutectoid alloy at 250°C followed by diffusion bonding between 350 and 390°C. The bonding strength of the new joints exhibits almost the same value at the temperature range from RT to 300°C, above which it decreases slightly with increasing temperature. It is also found that the bonding strength of the new joints is 8 times as high as those of a high-temperature Pb-5wt%Sn-1.5wt%Ag solder and the Al-Zn eutectoid alloy solder without utilizing superplasticity at 250°C. The Al-Zn eutectoid alloy solder joint has shown high reliability in the temperature cycle testing between 50°C and 300°C up to 300 cycles.

• Periodical: Materials Science Forum (Volumes 838-839)
• Pages: 482-487
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.838-839.482
• Online since: January 2016
• Authors: Jin Onuki*, Akane Saitou, Akio Chiba, Kunihiro Tamahashi, Yoshinobu Motohashi, Yuji Kawamata
• Keywords: Al-Zn-Eutectoid Alloy Solder, High-Temperature Power Semiconductor Devices, Superplasticity

References

[1] T. Kurosu, K.P. Khoo, Y. Nakamura, K. Ozaki, N. Ishikawa, J. Onuki, Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates, Mater. Trans. 53 (2012) 451-456.

DOI: 10.2320/matertrans.m2011277

[2] H. Ohashi, et al., Power Electronics Innovation with Next Generation Advanced Power Devices, IEICE, Vol. E87-B, No. 12, 2004, pp.3422-3429.

[3] P.L. Dreike, D.M. Fleetwood, D.B. King, D.C. Sprauer, T.E. Zipperian, Electronic Device Technologies and Potential Applications, IEEE Trans. CPMT, Part A17 (1994) 594-609.

DOI: 10.1109/95.335047

[4] M.C. Shaw, J.R. Waldrop, S. Chandrasekaran, B. Kagalwara, Enhanced Thermal Management by Direct Water-Spray of High-Voltage", "High-Power Devices in a Three-Phase 18-hp Motor Drive Demonstration, Proc. 2002 Inter Society Conference on Thermal Phenomena, pp.1007-1014.

DOI: 10.1109/itherm.2002.1012567

[5] S-J. Kim, K-S. Kim, S-S. Kim, C-Y. Kang, Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application, Mater. Trans. 49 (2008) 1531-1536.

DOI: 10.2320/matertrans.mf200809

[6] R.R. Chromik, D-N. Wang, A. Shungar, L. Limata, M.R. Notis, R.P. Vinci, Mechanical Properties of Intermetallic Compounds in the Au-Sn System, J. Mater. Res. 20 (2005) 2161-2172.

DOI: 10.1557/jmr.2005.0269

[7] C-C. Chi, T-H. Chuang, Intermetallic reactions in Sn-3. 5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads, J. Electronic Mater. 35 (2006) 471-478.

DOI: 10.1007/bf02690534

[8] Y.T. Lai, C.Y. Liu, Study of Wetting Reaction between Eutectic AuSn and Au Foil, J. Electronic Mater. 35 (2006) 28-34.

DOI: 10.1007/s11664-006-0180-3

[9] D. Li, S. Delasante, G. Borzone, The Effect of Sb Addition on Sn-based Alloys for High-temperature Lead-free Solders: An Investigation of the Ag-Sb-Sn system, J. Electronic Mater. 41 (2012) 67-85.

DOI: 10.1007/s11664-011-1752-4

[10] J.S. Kim, W.S. Choi, D. Kim, A. Shkel, C.C. Lee, Fluxless Silicon-to-Alumina Bonding Using Electroplated Au–Sn–Au Structure at Eutectic Composition, Mater. Sci. Eng. A458 (2007) 101-107.

DOI: 10.1016/j.msea.2006.12.106

[11] J. Chang, S-K Seo, H. Mo Lee, Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C, J. Electronic Mater. 39 (2010) 2643-2652.

DOI: 10.1007/s11664-010-1313-2

[12] K. Suganuma, S-J. Kim, K-S. Kim, High-temperature lead-free solders: Properties and possibilities, JOM 61 (2009) 64-71.

DOI: 10.1007/s11837-009-0013-y

[13] R.W. Logan, A.K. Mukherjee, Effect of Thermomechanical Treatment on Superplasticity of Zn - 22%Al, Mater. Sci. Eng. 54 (1982) 237-246.

DOI: 10.1016/0025-5416(82)90118-5

[14] P.M. Hazzledine, Y. Motohashi, Important Parameters in Superplastic Deformation of Single Phase and Two Phase Alloys, Proc. International Conf. on Superplasticity, 1985, Grenoble, p.1. 1-1. 15.

[15] M. Hansen, Constitution of Binary Alloys, McGraw Hill, (1958).