Relaxation of Thermal Residual Stress in Laser Irradiated Fused Silica by Annealing Process

Run Qiang Li; Peng Yao; Wei Wang; Jun Wang; Chuan Zhen Huang; Zhi Hong Yang; Yue Liu

doi:10.4028/www.scientific.net/MSF.874.345

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HomeMaterials Science ForumMaterials Science Forum Vol. 874Relaxation of Thermal Residual Stress in Laser...

Relaxation of Thermal Residual Stress in Laser Irradiated Fused Silica by Annealing Process

Abstract:

To relax the surface residual stress of fused silica lens or windows irradiated by CO₂ laser, it was proposed to treat it at high temperature above glass strain temperature in the traditional annealing process. However it is a time and energy consuming process, and a distortion will be introduced during the heat treatment. To deal with these problems, annealing temperatures lower than glass strain temperature were applied to the annealing process and a new scheme was designed in this paper. An numerical model was built to simulate the laser induced residual stress and optimize the stress variation in the annealing process. The surface stress of fused silica can be relaxed and deformation induced by heat treating can be ignored.

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Periodical:

Materials Science Forum (Volume 874)

Pages:

345-350

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.874.345

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Online since:

October 2016

Authors:

Run Qiang Li, Peng Yao*, Wei Wang, Jun Wang, Chuan Zhen Huang, Zhi Hong Yang, Yue Liu

Keywords:

Anneal, FEM, Fused Silica, Residual Stress, Viscoelasticity

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References

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