Effect of Mold Temperature on Surface Segregation of Continuous Unidirectional Solidified Cu-Ag Alloy

Abstract:

The Cu–3%Ag alloy was prepared by continuous unidirectional solidification technique. The composition distribution of continuous unidirectional solidification Cu–3%Ag alloy was analyzed. The effect of different mold temperatures on the composition distribution of alloy was studied. The results show that when the mold temperature is low, continuous unidirectional solidification Cu–3%Ag alloy has surface segregation. The morphology of segregation phase mainly presents stripe and water drop shape. When the mold temperature is high, the surface segregation begins to decrease and eventually disappear.

• Periodical: Materials Science Forum (Volume 953)
• Pages: 26-31
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.953.26
• Online since: May 2019
• Authors: Ji Hui Luo*, Li Juan Xiang, Xun Gan, Sun Han, An Lin Deng, Ling Ling Zhang
• Keywords: Continuous Unidirectional Solidification, Cu-Ag Alloy, Surface Segregation

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