Materials Science Forum
Wood, which always looks quite solid to the naked eye, actually possesses a very intricate and exquisite structure; developed by Nature primarily to fulfil the requirements of a growing tree. How well the structure satisfies the needs of a construction material as used by humans is quite another matter - so to speak. Besides being an important constructional material, wood is today also an important source of precursors for the medical and chemical compounds used by human beings. These, and many other aspects of wood, are topics which materials science attempts to elucidate. When wood is used as a constructional material, human interest normally focuses on xylem, the “woody” inner portion of the trunk of a tree. The outer sections of the tree, the bark and cambium, mainly interest humans for reasons other than constructional.
As wood is an organic polymer-matrix composite, the study of wood might be assumed to be the province mainly of polymer scientists. This is not true however: materials scientists working on polymers are almost absent from research into wood. The situation is actually quite odd; since wood offers plenty of ideas which would also be applicable to synthetic polymers and their composites. This situation is reflected by the contents of this publication.
This special volume addresses fundamental and practical aspects of high-temperature corrosion and protection. It stresses that devoting attention to an understanding of the corrosion problems encountered by contemporary industry, and providing opportunities for extended interaction, could lead to approaches for improving the performance of materials and protective measures.
This interesting volume focuses on powder production, sintering mechanisms, sintering furnaces and nanomaterials, automotive applications and future possibilities.
This special-topic volume‚ Advances in Light-Emitting Materials’, makes an important contribution to the field of silicon and III-nitride semiconductors. It begins with a brief history of visible-light emitting diodes. However, silicon is currently expanding from micro-electronics and into photonics. Due to its unsuitable band-gap, it has not previously been the material-of-choice for opto-electronic integration. That is now beginning to change and silicon devices have been developed which have the capability to emit, modulate, guide and detect light and which can be combined with microelectronics to form electronic and photonic integrated circuits.
This collection comprises state-of-the-art papers written by scientists and research groups working in fields encompassing metals and alloys, silicates, polymers and composites.
Chapter 1 - Biomaterials (19 papers); Chapter 2 - Ceramics (16 papers); Chapter 3 - Composite Materials (15 papers); Chapter 4 - Electronic, Magnetic and Photonic Materials (20 papers); Chapter 5 - Metals and Alloys (17 papers); Chapter 6 - Nano and Microstructural Materials (12 papers); Chapter 7 - Polymers (17 papers); Chapter 8 - Paper, Textiles, Wood and Cork (7 papers) Chapter 9 - Smart Materials (6 papers); Chapter 10 - Advances in Materials Characterization (7 papers); Chapter 11 - Materials and Processing Modelling (9 papers); Chapter 12 - Recycling (10 papers); Chapter 13 - Surfaces, Interfaces and Membranes (12 papers); Chapter 14 - Materials for Civil Engineering Applications (12 papers); Chapter 15 - Materials for Energy Production, Transport, Storage and Mechanical Engineering Applications (14 papers); Chapter 16 - Foresight, Materials and Art, Generic (7 papers).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special collection comprises 175 peer-reviewed articles on “Nanomaterials by Severe Plastic Deformation”. This large number of papers is a convincing demonstration of the relevance of bulk ultrafine grained and nanostructured materials, produced by severe plastic deformation, to a wide range of researchers and engineers. In fact, this community is growing, and the total number of articles in this edition is larger than that in the 2006 edition. The fact that the authors hail from 27 countries also reflects the truly world-wide activity in this field.
The aim of this special collection of papers on the theme of “Advanced Welding and Micro Joining/Packaging for the 21st Century” was to review and analyze the state-of-the-art concerning the welding and joining/packaging technologies which are essential to the production of structures ranging from the compact to the ultra-large.