Materials Science Forum
This special-topic volume‚ Advances in Light-Emitting Materials’, makes an important contribution to the field of silicon and III-nitride semiconductors. It begins with a brief history of visible-light emitting diodes. However, silicon is currently expanding from micro-electronics and into photonics. Due to its unsuitable band-gap, it has not previously been the material-of-choice for opto-electronic integration. That is now beginning to change and silicon devices have been developed which have the capability to emit, modulate, guide and detect light and which can be combined with microelectronics to form electronic and photonic integrated circuits.
This collection comprises state-of-the-art papers written by scientists and research groups working in fields encompassing metals and alloys, silicates, polymers and composites.
Chapter 1 - Biomaterials (19 papers); Chapter 2 - Ceramics (16 papers); Chapter 3 - Composite Materials (15 papers); Chapter 4 - Electronic, Magnetic and Photonic Materials (20 papers); Chapter 5 - Metals and Alloys (17 papers); Chapter 6 - Nano and Microstructural Materials (12 papers); Chapter 7 - Polymers (17 papers); Chapter 8 - Paper, Textiles, Wood and Cork (7 papers) Chapter 9 - Smart Materials (6 papers); Chapter 10 - Advances in Materials Characterization (7 papers); Chapter 11 - Materials and Processing Modelling (9 papers); Chapter 12 - Recycling (10 papers); Chapter 13 - Surfaces, Interfaces and Membranes (12 papers); Chapter 14 - Materials for Civil Engineering Applications (12 papers); Chapter 15 - Materials for Energy Production, Transport, Storage and Mechanical Engineering Applications (14 papers); Chapter 16 - Foresight, Materials and Art, Generic (7 papers).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special collection comprises 175 peer-reviewed articles on “Nanomaterials by Severe Plastic Deformation”. This large number of papers is a convincing demonstration of the relevance of bulk ultrafine grained and nanostructured materials, produced by severe plastic deformation, to a wide range of researchers and engineers. In fact, this community is growing, and the total number of articles in this edition is larger than that in the 2006 edition. The fact that the authors hail from 27 countries also reflects the truly world-wide activity in this field.
The aim of this special collection of papers on the theme of “Advanced Welding and Micro Joining/Packaging for the 21st Century” was to review and analyze the state-of-the-art concerning the welding and joining/packaging technologies which are essential to the production of structures ranging from the compact to the ultra-large.
This collection addresses specific topics within the field of stress measurement in solids using neutrons, X-rays and synchrotron radiation. Particular attention is paid to multidisciplinary approaches involving an understanding of the measured stress field and the implications of the stress field for the behaviour of materials and components.