Pulse Plasma Sintering of Nano-Crystalline Cu Powder

Andrzej Michalski; Marcin Rosiński; D. Siemiaszko; Jakub Jaroszewicz; Krzysztof Jan Kurzydlowski

doi:10.4028/www.scientific.net/SSP.114.239

Paper Titles

Microstructural Evolution during Mechanical Alloying and Hot Pressing of a Powder Blend of Aluminium and 316 Stainless Steel
p.211

Fabrication and Micro-Structure Characterization of Al₂O₃/Ni-P Composites with Interpenetrating Phases
p.219

Nanocrystalline Cu-Al₂O₃ Composites Sintered by the Pulse Plasma Technique
p.227

Nanocrystalline NiAl-TiC Composites Sintered by the Pulse Plasma Method
p.233

Pulse Plasma Sintering of Nano-Crystalline Cu Powder
p.239

Nanocrystalline Cemented Carbides Sintered by the Pulse Plasma Method
p.245

Influence of High Pressure Hot Compaction on Microstructure of Al-Si-Ni-Mm Alloys
p.251

SiC – Zn Nanocomposites Obtained Using the High – Pressure Infiltration Technique
p.257

Downscaling Equal Channel Angular Pressing
p.265

HomeSolid State PhenomenaSolid State Phenomena Vol. 114Pulse Plasma Sintering of Nano-Crystalline Cu...

Pulse Plasma Sintering of Nano-Crystalline Cu Powder

Abstract:

Nanocrystalline copper powders, produced by the reduction of the CuO with hydrogen, were consolidated using the pulse plasma sintering (PPS) method. The sintering process was carried out at temperatures between 500 and 900 oC under a load of 60 MPa for 5 min. The average crystallite size of the sintered component obtained at 500 oC was about 80nm and at 900 oC 1880 nm. The components produced at 500 oC had a relative density of 90 %, and those sintered at 900 oC 92 %; their hardness was 215 and 140 HV0.1, respectively.

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Periodical:

Solid State Phenomena (Volume 114)

Pages:

239-244

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.114.239

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Online since:

July 2006

Authors:

Andrzej Michalski, Marcin Rosiński, D. Siemiaszko, Jakub Jaroszewicz, Krzysztof Jan Kurzydlowski

Keywords:

Cu, Nanocrystalline, PPS, Sintering

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