Nanocrystalline Cu-Al2O3 Composites Sintered by the Pulse Plasma Technique

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The paper presents the results of examination of the structure and properties of nanocrystalline Cu-Al2O3 composites with the two different Al2O3 contents: 10 and 20 vol.%. The composites were produced using a mixture of copper and Al2O3 powders with an average crystallite size of about 60nm for Cu and about 40nm for Al2O3. The powders were consolidated by pulse plasma sintering (PPS) for 5 minutes at a temperature of 650oC under a load of 60 MPa. Irrespective of the volumetric content of Al2O3, the relative density of the composites was about 92%, and the average Cu crystallite size was about 80nm. The hardness of the composites varied with the volumetric content of Al2O3, and was equal to 270 HV0.1 for 20 and to 240 HV0.1 for 10% of Al2O3. The Cu-20%Al2O3 composite had a resistivity of 0.386 while that with 10% of Al2O3 was 0.149 56m.

Info:

Periodical:

Solid State Phenomena (Volume 114)

Edited by:

Witold Lojkowski and John R. Blizzard

Pages:

227-232

DOI:

10.4028/www.scientific.net/SSP.114.227

Citation:

A. Michalski et al., "Nanocrystalline Cu-Al2O3 Composites Sintered by the Pulse Plasma Technique", Solid State Phenomena, Vol. 114, pp. 227-232, 2006

Online since:

July 2006

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Price:

$35.00

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