Modeling and Simulation of Carbon Nanotube Interconnect Network

Abstract:

Article Preview

The electrical properties of metallic carbon nanotubes (CNT) can rival, or even exceed, the best metals known. It is a potential candidate for future on-chip interconnect, whose performance will be dominant in the next generation integrated circuits. In this paper, a study on the modeling and simulation techniques for the CNT interconnect network is carried out. The frequency-independent models of CNT interconnects in terms of resistance, inductance and capacitance are summarized. A novel frequencydependent circuit model is proposed for CNT for various high-frequency applications. Preliminary analysis shows a good match between numerical simulations and the compact model. The proposed modeling and simulation techniques for CNT interconnect network are expected to play an important role in the future CNT nanotechnology applications.

Info:

Periodical:

Solid State Phenomena (Volumes 121-123)

Edited by:

Chunli BAI, Sishen XIE, Xing ZHU

Pages:

1057-1060

DOI:

10.4028/www.scientific.net/SSP.121-123.1057

Citation:

C. Dong et al., "Modeling and Simulation of Carbon Nanotube Interconnect Network", Solid State Phenomena, Vols. 121-123, pp. 1057-1060, 2007

Online since:

March 2007

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.