The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp

Abstract:

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We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.

Info:

Periodical:

Solid State Phenomena (Volumes 121-123)

Edited by:

Chunli BAI, Sishen XIE, Xing ZHU

Pages:

649-652

DOI:

10.4028/www.scientific.net/SSP.121-123.649

Citation:

K. D. Kim et al., "The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp", Solid State Phenomena, Vols. 121-123, pp. 649-652, 2007

Online since:

March 2007

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Price:

$35.00

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