The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp
We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.
Chunli BAI, Sishen XIE, Xing ZHU
K. D. Kim et al., "The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp", Solid State Phenomena, Vols. 121-123, pp. 649-652, 2007