The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp

Ki Don Kim; Young Suk Sim; Jun Ho Jeong; Hyun Kee Sohn; Eung Sug Lee; Sang Chan Lee; Ling Mei Fang

doi:10.4028/www.scientific.net/SSP.121-123.649

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The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp

Abstract:

We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.