Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni

Dae Hoon Lee; Tae Suk Jang; J.H. Jung; S.S. Hong; E.S. Park; J.W. Lee; B.K. Hahn

doi:10.4028/www.scientific.net/SSP.124-126.227

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Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni
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HomeSolid State PhenomenaSolid State Phenomena Vols. 124-126Feasibility of Copper-Base Leadframe Preplated...

Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni

Abstract:

A preplated frame (PPF) consisting of Au/Pd/Cu-Sn/Cu substrate, i.e., preplated with a Cu-Sn alloy instead of Ni commercially used, was fabricated by electroplating and then the feasibility of the frame as an alternative PPF was investigated. The wettability of the Cu-Sn alloy was better than that of Ni, resulting in excellent contact with the substrate and smoother surface on the upper Au/Pd protective layer. By XPS analyses, it was confirmed that Cu atoms in the Cu-Sn alloy layer did not diffuse through the thin protective layer to the surface at temperatures used in IC assembly. The wire pull-strength and solderability of the Cu-Sn alloy PPF were almost equivalent to those of the Ni PPF. However, the former showed much better corrosion resistance than the latter.

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Periodical:

Solid State Phenomena (Volumes 124-126)

Pages:

227-230

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.124-126.227

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Online since:

June 2007

Authors:

Dae Hoon Lee, Tae Suk Jang, J.H. Jung, S.S. Hong, E.S. Park, J.W. Lee, B.K. Hahn

Keywords:

Cu-Sn Alloy, Electroplating, IC Packaging, Leadframe, Preplated Frame (PPF)

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