Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles

Abstract:

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Fabrication of paste at low temperature has been developed in order to apply for various electronic devices, such as bus electrode and address electrode in PDP, especially for enlargement of a screen size. In this study, nano-sized silver particles with 10 - 30 nm were synthesized from silver nitrate (AgNO3) by a chemical reduction method. To prepare Pb-free silver paste, the silver nanoparticles were mixed with conventional silver powder with an average particle size of 1.6  and conventional Pb-free frit. Thick films were fabricated from silver paste by a screen printing on alumina substrate and the films were fried at temperatures ranging from 550 °C to 600 °C. Microstructures of the fried thick films were analyzed by FE-SEM. Sheet resistivity of fried thick films was measured and also the relationship between sinterability and conductivity of these films were investigated.

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park

Pages:

639-642

DOI:

10.4028/www.scientific.net/SSP.124-126.639

Citation:

S. H. Park et al., "Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles", Solid State Phenomena, Vols. 124-126, pp. 639-642, 2007

Online since:

June 2007

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Price:

$35.00

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