Si Wafer Bonding: Structural Features of the Interface

Abstract:

Article Preview

Kinetics of oxide layer dissolution and atomic structure of Si-Si interface in Si wafer bonded structures have been investigated by transmission electron microscopy. Samples of Si(001)/SiO2/Si(001) and Si(110)/SiO2/Si(001) structures were fabricated by direct hydrophilic wafer bonding of 200 mm wafers followed by high temperature annealing. It is found that the decomposition rate of oxide layer and formation of Si-Si bonded interface depends very much on lattice mismatch and twist angle.

Info:

Periodical:

Solid State Phenomena (Volumes 156-158)

Edited by:

M. Kittler and H. Richter

Pages:

85-90

DOI:

10.4028/www.scientific.net/SSP.156-158.85

Citation:

V.I. Vdovin et al., "Si Wafer Bonding: Structural Features of the Interface", Solid State Phenomena, Vols. 156-158, pp. 85-90, 2010

Online since:

October 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.