Structural Stability of Cu Processed by Severe Plastic Deformation Method

Abstract:

The annealing behaviour of monocrystaline Cu processed by Cyclic Extrusion Compression (CEC) was investigated. The effect of the CEC strain on the annealing behaviour of submicrometer grained structure was studied by examination of the microstructural changes of the samples processed by two different CEC strains, 4.8 and 13.9 during annealing at 300oC for the time in the range from 1sec to 120 min. The results show that microstructure is stable up to an annealing time of 15 min. At a higher time of annealing (above 15 min), a gradual grain growth occurs.

• Periodical: Solid State Phenomena (Volume 163)
• Pages: 114-117
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.163.114
• Online since: June 2010
• Authors: Kinga Rodak, Krzysztof Radwański
• Keywords: Cu, Electron Backscatter Diffraction (EBSD), Severe Plastic Deformation (SPD), Thermal Stability, Ultrafine Grained Structure

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