Comparisons of Various Physical Cleaning

Sang Won Bae; Dae Hyuk Kang; Hyo San Lee; Kuntack Lee; Yong Sun Koh

doi:10.4028/www.scientific.net/SSP.187.131

Paper Titles

Using the Background Signal of a Light Scattering Tool for I/I Photo Resist Strip Optimization and Monitoring
p.113

Wafer Edge Bead Cleaning with Laser Radiation and Reactive Gas
p.117

Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window
p.123

The Influence of Liquid Media on the Fracture Strength of Polysilicon Nanostructures
p.127

Comparisons of Various Physical Cleaning
p.131

Effects of Target Compliance on a High-Speed Droplet Impact
p.137

Order Estimation of Physical Processes in Dynamics of Steam-Water Mixed Spray Cleaning Technique
p.141

Thermomechanical Resist Removal-Cleaning System Using Cryogenic Micro-Slush Jet
p.145

Uniformity of Particle Removal by Aerosol Spray
p.149

HomeSolid State PhenomenaSolid State Phenomena Vol. 187Comparisons of Various Physical Cleaning

Comparisons of Various Physical Cleaning

Abstract:

Physical cleaning uses the physical force for particle removing process and the physical force can be represented by PRE(%) and pattern damage. Using the damage proving pattern, which was composed with conductive material for electrical detection, the damage of physical cleaning was quantitatively analyzed. And pattern damage was calculated with a form of damage density and plotted with pattern CD. Using PRE(%) and three parameters, which were derived in the damage density plot, the comparison of various physical cleaning was performed..