Removal of Fine Particle Using SAPS Technology and Functional Water

Abstract:

Space alternated phase shift (SAPS) megasonic technology incorporating with functional water, with dissolving gases H₂ or N₂, was applied to remove fine particle in wet cleaning processes of semiconductor manufacturing in this study. The performances of particle removal were investigated quantitatively by varying the parameters of functional water and megasonic energy. The optimized cleaning performance was further proved with significant yield improvement of mass production by comparison with other main cleaning technology.

• Periodical: Solid State Phenomena (Volume 195)
• Pages: 185-190
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.195.185
• Online since: December 2012
• Authors: David H. Wang, Yue Ma, Fu Ping Chen, Liang Zhi Xie, Xi Wang, Xiao Yan Zhang, Ju Young Lee, Dong Joo Kim, Jeong Yun Lee, Pyo Leem, Geun Min Choi
• Keywords: Functional Water, Particle Removal, SAPS Megasonic Technology

References

[1] Hiroshi Kurobe and Hiroshi Morita, Environmentally conscius design and inverse manufacturing, Dec. 590-591(2005).

[2] Masayuki Toda and Seijiu Uryuu, Cleaning technology in semiconductor device manufacturing VIII , Volume 26, 1-12(2003).

[3] Hiroshi Morita and Tochihiro Ii, Cleaning technology in semiconductor device manufacturing VI, Volume 36, 45-48(1999).

[4] Hiroshi Morita, Semiconductor Manufaturering, Dec. (2006).