Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership

J. Desagher; Don Dussault; M. Beck; R. Lillard; Eric Liebscher

doi:10.4028/www.scientific.net/SSP.195.201

Paper Titles

Removal of Fine Particle Using SAPS Technology and Functional Water
p.185

Non Destructive Nanoparticle Removal from Submicron Structures Using Megasonic Cleaning
p.191

Physical Cleaning Enhancement Using Advanced Spray with Uniform Droplet Control
p.195

CO₂-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System
p.198

Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership
p.201

Development of a Near-Field Megasonic Cleaning System for Nano-Particle Removal
p.205

Megasonic Cleaning to Remove Nano-Dimensional Contaminants from Wafer Surfaces: An Analytical Study
p.209

Frictional Analysis of PVA Brush for Post CMP Cleaning: Effects of Rotation Speed, Compression Distance, and Fluid Viscosity
p.213

A New Retention Method for Sub-10 nm Liquid Filtration Using Fluorescent CdSe QDs
p.217

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Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership

Abstract:

High frequency (1 MHz, megasonic) acoustic enhanced cleaning is a well established method of removing surface particles in semiconductor manufacturing processes. There are two fundamental designs of megasonic batch cleaning systems, indirect and direct.