Non Destructive Nanoparticle Removal from Submicron Structures Using Megasonic Cleaning

Pegah Karimi; Ahmed A. Busnaina; Bong Kyun Kang; Jin Goo Park

doi:10.4028/www.scientific.net/SSP.195.191

Paper Titles

Towards an Improved Megasonic Cleaning Process: Influence of Surface Tension on Bubble Activity in Acoustic Fields
p.173

Influence of Dissolved CO₂ on Bubble Activity in Pulsed Acoustic Fields
p.177

Evaluation of Very Dilute Alkaline Solutions for Wafer Cleaning with Megasonic Irradiation
p.181

Removal of Fine Particle Using SAPS Technology and Functional Water
p.185

Non Destructive Nanoparticle Removal from Submicron Structures Using Megasonic Cleaning
p.191

Physical Cleaning Enhancement Using Advanced Spray with Uniform Droplet Control
p.195

CO₂-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System
p.198

Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership
p.201

Development of a Near-Field Megasonic Cleaning System for Nano-Particle Removal
p.205

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Non Destructive Nanoparticle Removal from Submicron Structures Using Megasonic Cleaning

Abstract:

The removal of nanoparticles from patterned wafers is one of the main challenges facing the semiconductor industry. As the size of structures shrinks with each new generation of devices, it becomes more difficult to remove nanoscale particles. Nanostructures (specially, poly silicon lines) were found to be vulnerable to damage as a result of cavitation when megasocnic cleaning is utilized. Megasonics utilizes acoustic streaming to reduce the acoustic boundary layer and utilize the generated pulsating flow to remove nanoscale particles from trenches and other structures on the wafer. Although Megasonics is believed to be a solution for many of these cleaning challenges, it has been shown to cause damage to nanoscale device structures such as poly-silicon lines.