Advanced Cryogenic Aerosol Cleaning: Small Particle Removal and Damage-Free Performance

Chimaobi Mbanaso; Jeffery W. Butterbaugh; David Scott Becker; Wallace P. Printz; Antonio L.P. Rotondaro; Derek W. Bassett; Gregory P. Thomes; Brent D. Schwab; Christina Ann Rathman; Jeffrey M. Lauerhaas

doi:10.4028/www.scientific.net/SSP.255.195

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Liquid Cell Platform to Directly Visualize Bottom-Up Assembly and Top-Down Etch Processes inside TEM
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A Study on the Electrostatic Discharge (ESD) Defect in SOH Mask Pattern Cleaning
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Post-CMP Cleaners for Tungsten at Advanced Nodes
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Advanced Cryogenic Aerosol Cleaning: Small Particle Removal and Damage-Free Performance
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Characterization of Cavitation in a Single Wafer or Photomask Cleaning Tool
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Rapid Recovery Process of Plasma Damaged Porous Low-k Dielectrics by Wet Surface Modifying Treatment
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HomeSolid State PhenomenaSolid State Phenomena Vol. 255Advanced Cryogenic Aerosol Cleaning: Small...

Advanced Cryogenic Aerosol Cleaning: Small Particle Removal and Damage-Free Performance

Abstract:

The performance of a new cryogenic aerosol process was evaluated for cleaning nanoparticles and providing damage-free processing. Particle Removal Efficiency (PRE) tests conducted with wet deposited 40 nm, 30 nm and 18 nm silica particles on 300 mm wafers demonstrated cleaning efficiencies above 80%. Damage-free capability of the cryogenic aerosol process was evaluated with poly-silicon lines with an aspect ratio of approximately 9:1. These results highlight the potential of this new cryogenic aerosol to provide semiconductor device yield benefits by reducing small particulate contamination without causing pattern damage.

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Periodical:

Solid State Phenomena (Volume 255)

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195-200

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.255.195

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Online since:

September 2016

Authors:

Chimaobi Mbanaso*, Jeffery W. Butterbaugh, David Scott Becker, Wallace P. Printz, Antonio L.P. Rotondaro, Derek W. Bassett, Gregory P. Thomes, Brent D. Schwab, Christina Ann Rathman, Jeffrey M. Lauerhaas

Keywords:

Cryogenic Nanoaerosol, Damage-Free, Haze, Hydrophobic, Low-K, Particle Removal Efficiency (PRE)

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