Electrolyzed Water for Efficient Metal Removal

John Oshinowo; Ann Kristine Neelsen; Matthias Fryda; Lutz Rebstock; Ulrich Quarti

doi:10.4028/www.scientific.net/SSP.255.375

Paper Titles

Surface Optimization of Random Pyramid Textured Silicon Substrates for Improving Heterojunction Solar Cells
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Ultra-Trace Sulfate Ion Removal on Photomasks for Haze Reduction
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Electrolyzed Water for Efficient Metal Removal
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HomeSolid State PhenomenaSolid State Phenomena Vol. 255Electrolyzed Water for Efficient Metal Removal

Electrolyzed Water for Efficient Metal Removal

Abstract:

This work demonstrates the efficient removal of various metals from the plastic surface of wafer storage cassettes (FOUP’s) by using electrolyzed water. The studies are ruled out for Anodic water chloride. This new wet cleaning technology is a powerful application, not for FOUP’s only, but also for innovative semiconductor surface preparation and FEOL cleaning applications.

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Periodical:

Solid State Phenomena (Volume 255)

Pages:

375-380

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.255.375

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Online since:

September 2016

Authors:

John Oshinowo*, Ann Kristine Neelsen, Matthias Fryda, Lutz Rebstock, Ulrich Quarti

Keywords:

Anodic Water (AW), Anodic Water Chloride (AW-Cl), Cathode Water (CW), Electrolyzed Water, FEOL Wet Clean, FOUP, HCl, Oxidation Reduction Potential (ORP), pH-Value, SC2

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* - Corresponding Author

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